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Silicon Nitride Sheet

Additional information

Catalog No.

SN1939

Material

Silicon Nitride

Color

Black

Density

3.21 g/cm3

Flexural Strength

800 MPa

Fracture Toughness

6.5 MPam 1/2

Thermal Stress Parameters

569 K

Thermal Expansion Coef.

1.4~3.7 S.I.

Size

Customized

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Description:

The hot-pressed silicon nitride (Si₃N₄) ceramic substrate, also known as a ceramic sheet, is a high-performance material made by precision hot pressing.It features high strength, excellent heat resistance, wear resistance, and electrical insulation, making it ideal for high-load and high-temperature applications.The hot-pressing process provides uniform density and a smooth, flat surface, suitable for use in electronics, machinery, aerospace, and other advanced industries.

  • High Mechanical Strength
    Silicon nitride ceramics offer exceptional hardness and impact resistance. They can withstand high mechanical stress without cracking or deforming, making them ideal for use in demanding, high-stress environments.
  • Excellent High-Temperature Resistance
    Capable of stable operation at temperatures above 1200°C, this material provides outstanding thermal stability and is well suited for use in high-temperature equipment and systems.
  • Low Thermal Expansion
    With a low coefficient of thermal expansion (3.1 × 10⁻⁶ /°C), the material maintains dimensional stability under rapid temperature fluctuations, making it ideal for heat exchangers and furnace linings.
  • Superior Wear Resistance
    Hot-pressed silicon nitride ceramics offer excellent wear resistance, ensuring long service life even under high-friction conditions.
  • Outstanding Thermal Conductivity
    Despite their high mechanical strength, these ceramics maintain good thermal conductivity, making them suitable for use in cooling systems and heat exchangers.
  • Excellent Electrical Insulation
    This ceramic material has high electrical insulation properties, making it ideal for use in electrical substrates and applications requiring dielectric performance.

Applications:

With its high performance and long-term stability, the hot-pressed silicon nitride ceramic substrate provides reliable solutions across a wide range of high-tech industries. It offers irreplaceable advantages in applications requiring high temperature resistance, mechanical load endurance, friction resistance, and electrical insulation.

  • Heat Exchangers
    Used as partition plates in heat exchangers, leveraging their high thermal conductivity and thermal stability to improve energy efficiency and thermal management performance.
  • Combustion Chamber Linings
    Applied in combustion chambers and other high-temperature environments to provide thermal protection and extend equipment lifespan through excellent heat resistance.
  • Semiconductor Manufacturing
    Used in semiconductor fabrication—especially during high-temperature processes—to protect and isolate sensitive components, preventing thermal damage and chemical corrosion.

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